Contract Manufacturing
Contract Manufacturing
PUNCOM’s manufacturing infrastructure is one of the best in India and undertakes large scale contract manufacturing activities in the field of Information Technology and Telecommunication.
SMT Pick n Place
- SMT Pick & Place Fuji Aimex IIS
- Chip on board BGA flip chip,ultra fine pitch.
- Fine pitch placement upto 10 mil.
- Max 130 feeder slots (Electronic Intelligent Feeders), Tray Exchanger
- Component coplanarity Check
- CPH CHIP-25000, Fine Pitch – 5000
Reflow Oven
- Electrovert model omniflo 10.
- Upper and lower heating.
- Cooling zone.
- Forced Air Convection Type.
- 6 point thermal profiling.
- Thermal profile storage:1000.
Solder Paste Screen Printer
- Solder Paste Screen Printer NEO Horizon 03ix.
- Solder paste and glue Screen Printing
- Frame size max upto 29″X29″
- Print speed upto 2mm to 300mm/sec
- System alignment capacity ± 12.5 micron @6Sigma, Upto cpk>/=2
- Cycle Time = 8 Sec + Process
WaveSoldering
- Single and Double.Wave, No Clean Flux
- Temperature Controlled Pre heaters and Solder bath