PUNCOM's manufacturing infrastructure is one of the best in India and undertakes large scale contract manufacturing activities in the field of Information Technology and Telecommunication.

SMT Pick n Place

• SMT Pick & Place Fuji Aimex IIS
  
• Chip on board BGA flip chip,ultra fine pitch.
• Fine pitch placement upto 10 mil.
• Max 130 feeder slots (Electronic Intelligent Feeders), Tray Exchanger
  
• Component coplanarity Check
• CPH CHIP-25000, Fine Pitch - 5000

Reflow Oven

• Electrovert model omniflo 10.
• Upper and lower heating.
• Cooling zone.
• Forced Air Convection Type.
• 6 point thermal profiling.
• Thermal profile storage:1000.

Solder Paste Screen Printer

• Solder Paste Screen Printer NEO Horizon 03ix.
  
• Solder paste and glue Screen Printing
  
• Frame size max upto 29"X29"
• Print speed upto 2mm to 300mm/sec
• System alignment capacity ± 12.5 micron @6Sigma, Upto cpk>/=2
  
• Cycle Time = 8 Sec + Process

WaveSoldering

• Single and Double.Wave, No Clean Flux
  
• Temperature Controlled Pre heaters and Solder bath