Manufacturing
Manufacturing
Puncom is an ISO 9001:2015 certified company and has a state-of-the-art manufacturing facility spread over 1,90,000 sq. feet in Mohali, Chandigarh. Puncom’s telecommunication infrastructure includes:
Screen printer
- Solder Paste Screen Printer NEO Horizon 03ix
- Solder paste and glue Screen Printing
- Frame size max upto 29″X29″
- Print speed upto 2mm to 300mm/sec
- System alignment capacity ± 12.5 micron @6Sigma, Upto cpk>/=2
- Cycle Time = 8 Sec + Process
SMT Pick n Place
- SMT Pick & Place Fuji Aimex IIS
- Chip on board BGA flip chip,ultra fine pitch.
- Fine pitch placement upto 10 mil.
- Max 130 feeder slots (Electronic Intelligent Feeders), Tray Exchanger
- Component coplanarity Check
- CPH CHIP-25000, Fine Pitch – 5000
Reflow Oven
- Electrovert model omniflo 10.
- Upper and lower heating.
- Cooling zone.
- Forced Air Convection Type.
- 6 point thermal profiling.
- Thermal profile storage:1000.
Wave Soldering
- Single and Double.Wave, No Clean Flux
- Temperature Controlled Pre heaters and Solder bath.
Dehumidifier Cabinet
- Model AD1280ux
- 15-50% Rh with mechanical humidity control with digital display at room temperature
Discrete Assembly
- Through hole circuits use printed circuit board with holes, to hold components with wire leads.
- Wire leads of the components are inserted through holes in the board and track and then bonded to this track, by soldering.
Coil Winding
- One Electrotech tape winding machine
- Two Electrotech Coil winding machines, Six Tanaka Automatic coil winding machines