PUNCOM's manufacturing infrastructure is one of the best in India lending it the capability of undertaking large scale contract manufacturing activities in the field of Information Technology and Telecommunication.

SMT Pick n Place

• Two lines: Universal Model GSM1 and Siemens Model MS72
• Chip on board, BGA, flip chip, ultra fine pitch
  
• Glue dispensing
• Fine Pitch placement up to 10 mil
• 10000 CPH, On-the-fly vision centering
  

Reflow Oven

• Electrovert model omniflo 10
• Upper and lower heating
• Cooling zone
• Forced Air Convection Type 6 point thermal profiling
• Thermal Profile Storage:1000

Wave Soldering

• Single & double wave, No-flux
• Temperature controlled pre heaters