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Contract Manufacturing
  • Availability of a large pool of Experienced Technical manpower.
  • Strong Infrastructure and Manufacturing experience.
  • Access to top level technology support

PUNCOM's manufacturing infrastructure is one of the best in India lending it the capability of undertaking large scale contract manufacturing activities in the field of Information Technology and Telecommunication.

SMT Pick n Place

  • Two lines: Universal Model GSM1 and Siemens Model MS72
  • Chip on board, BGA, flip chip, ultra fine pitch
  • Glue dispensing
  • Fine Pitch placement up to 10 mil
  • 10000 CPH, On-the-fly vision centering

Reflow Oven

  • Electrovert model omniflo 10
  • Upper and lower heating
  • Cooling zone
  • Forced Air Convection Type 6 point thermal profiling
  • Thermal Profile Storage:1000

Wave Soldering

  • Single & double wave, No-flux
  • Temperature controlled pre heaters


Site developed and maintained by Puncom.